Our team contains experts in primary packaging, advanced packaging materials, pallets and distribution packaging, supply chain optimization, lean manufacturing, and process improvement. Our diverse expertise and 40+ years of knowledge generated through state-of-the-art research and real life industrial consulting allows us to help your company create safer, more sustainable, and cheaper packages, unit loads, and transportation systems. We are part of the Department of Sustainable Biomaterials in the College of Natural Resources & Environment at Virginia Tech.
CPULD is the one of the leading research facilities in the US that performs comprehensive research and development work, provides technical assistance, and offers educational programs focusing the whole packaging system – including pallets, primary and secondary packaging, and material handling equipment. Using state of the art technology, we research every aspect of the material handling system from primary packaging all the way through unit load design.
The Center for Packaging and Unit Load Design is an Industry/University Partnership. Membership is open to all individuals, firms, and associations interested in unit load based material handling efficiency. Industry members provide support, encouragement, advice, and funding. Membership funds help us attract and train high caliber employees and conduct state-of-the-art research needed by industry.
Our laboratories are certified to conduct tests by:
Alina is a graduate student from Costa Rica who is pursuing her M.S. degree in packaging. Alina’s research focuses on modeling the cost of low quality pallets on the cost of the supply chain.
Jessie is a 2017 Sustainable Packaging Designer Trainee. He is working as an ISTA certified lab technician and is investigating the effect of material handling on unit load containment force.
We’ve been working hard to create and maintain an up-to-date employment section here on our new website. In this area you’ll find listings for any position needing to be filled here at the Center for Packaging and Unit Load Design; Undergraduate Internships, Graduate Study Assistantships, and even just part-time employment opportunities.
We are currently seeking multiple interns to help with the development of new classes about the IoT and Smart Packaging as well as to help design and create smart sensors and packaging for research studies.
Qualified candidates for our Smart Packaging Internship will be responsible for conducting independent research, developing practical laboratory exercises using systems and sensors connected to raspberry pi or similar systems, as well as helping faculty to create coursework that will disseminate this info to the next generation of packaging students
Qualified candidates for our Packaging IoT Development Internship will be responsible for designing and building working sensors capable of recording acceleration, temperature, shock, location and communicating the results throughout the internet using lows cost single board computers as well as developing control programs for specialized data collection.
The Center for Packaging and Unit Load Design fall newsletter is now finished and posted to the About Us section of our website.
In it you will find news regarding Center activities over the past few months; including articles regarding the ISTA certification of our lab workers, the IKEA certification of our corrugated lab, and the recent donation by our industry partner, Lightning Technologies. You will also be introduced to our lab interns, read the summaries of recent Center graduate students’ research projects, and more!
Please enjoy and feel free to share CPULD’s fall newsletter!
In today’s competitive economic era, the ability to protect your product for a competitive price is indispensable. There are two essentials needed to create sustainable packaging solutions: knowledge of the interactions between the different components of the packaging systems and professionals who know how to apply the principles of systems based packaging design.
Our Affiliate Membership program brings together industry professionals. At our annual meetings, we discuss the Center’s past year of research projects, the results discovered, and how the new knowledge will assist the industry. Our members also help determine where future research projects should be focused for the upcoming year.
If you would like to benefit from this pool of knowledge and help shape the future of packaging and pallet research, we hope you’ll consider joining the Center and attending the Annual Membership Meeting.